Sponsor & Exhibition
Important Dates
-
November 30 2020
Full Paper Submission Due -
December 20 2020
Full Paper Review
(For the new submitted papers) -
January 15 2021
Final Full Paper Submission Due
(For the new submitted papers) -
January 31 2021
Early Bird Registration Due
-
February 19 2021
Pre-recorded presentations Submission Due
TODAY 2021. 01. 20
HEAT PUMP CONFERENCE 2020
D-96
Sponsor & Exhibition
The Heat Pump Conference 2020 welcomes all kinds of sponsors and exhibitors from interested companies and institutions. This will be a great opportunity to promote the true value of your product and services. Moreover, you will be interacting and communicate with the international participants. The sponsors will have maximal benefits from on-line(webpage) and off-line(program book) advertisement, marketing activities, and communications with participants during the conference. The sponsors will have benefits from the package programs of sponsorship in reward for their contribution to the conference.


Please click a button below for more specified information.
Invitation to Industrial Sponsorship※ Those who are interested in sponsorship of HPC 2020, please contact to the conference secretariat at secretariat@hpc2020.org for detailed information.