Sponsor & Exhibition

Important Dates

  • November 30 2020

    Full Paper Submission Due

  • December 20 2020

    Full Paper Review
    (For the new submitted papers)

  • January 15 2021

    Final Full Paper Submission Due
    (For the new submitted papers)

  • January 31 2021

    Early Bird Registration Due

  • February 19 2021

    Pre-recorded presentations Submission Due

TODAY 2021. 01. 20



Sponsor & Exhibition

The Heat Pump Conference 2020 welcomes all kinds of sponsors and exhibitors from interested companies and institutions. This will be a great opportunity to promote the true value of your product and services. Moreover, you will be interacting and communicate with the international participants. The sponsors will have maximal benefits from on-line(webpage) and off-line(program book) advertisement, marketing activities, and communications with participants during the conference. The sponsors will have benefits from the package programs of sponsorship in reward for their contribution to the conference.

Please click a button below for more specified information.

Invitation to Industrial Sponsorship

※ Those who are interested in sponsorship of HPC 2020, please contact to the conference secretariat at secretariat@hpc2020.org for detailed information.