Sponsor & Exhibition

Important Dates

  • January 1 2019

    Abstract submission open

  • June 30 2019

    Extended abstract submission due

  • November 15 2019

    Extended Full Paper Submission Due

  • February 15 2020

    Final paper submission due

Co-organized by

TODAY 2019. 12. 06

HEAT PUMP CONFERENCE 2020

D-157

Sponsor & Exhibition

The Heat Pump Conference 2020 welcomes all kinds of sponsors and exhibitors from interested companies and institutions. This will be a great opportunity to promote the true value of your product and services. Moreover, you will be interacting and communicate with the international participants. The sponsors will have maximal benefits from on-line(webpage) and off-line(program book) advertisement, marketing activities, and communications with participants during the conference. The sponsors will have benefits from the package programs of sponsorship in reward for their contribution to the conference.

Please click a button below for more specified information.

Invitation to Industrial Sponsorship

※ Those who are interested in sponsorship of HPC 2020, please contact to the conference secretariat at secretariat@hpc2020.org for detailed information.